Method for cleaning substrate and apparatus therefor
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 3, 2002
app pub date -
Sep 20, 2001
filing date -
Sep 20, 2000
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A substrate cleaning method and an apparatus therefor capable of increasing a particle removal ratio at which particles firmly adhering to a substrate are removed therefrom and increasing a throughput. A substrate such as a wafer or the like placed in a cleaning tank filled therein with a cleaning liquid is cleaned by an ultrasonic vibration. Cleaning of the substrate is carried out in such a manner that an ultrasonic vibration is applied to the substrate from a bottom of the cleaning tank, during which application the substrate is kept at a predetermined inclination angle with respect to a direction of acoustic streaming in the cleaning liquid formed by propagation of an ultrasonic wave.
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