Wet process station with water spray of wafer reverse side
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United States of America Patent
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N/A
Issued Date -
Oct 3, 2002
app pub date -
Apr 2, 2001
filing date -
Apr 2, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
An arrangement for wet-etching a semiconductor wafer simultaneously subjects the reverse side to a water rinse. A semiconductor wafer is placed face down on top of a cylindrical tower, and an etchant such as hydrofluoric acid is sprayed up against that face through a nozzle at the base of the tower. On the upper side of the wafer another water jet flows deionized water onto the wafer to shield the upper surface from any vapors that may escape around the seal. An exhaust vent arrangement surrounding the tower pulls air containing any stray etchant vapors radially outward from the vicinity of the wafer.
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