Micromachined springs for strain relieved electrical connections to IC chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
N/A
app pub date -
Dec 31, 2001
filing date -
Dec 29, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
The present invention provides a technique for interconnecting two or more substrates, in which the interconnecting elements are mechanically compliant. Compliant electrical connections between substrates are desirable for absorbing stresses that occur due to thermal cycling. The invention also provides a scalable technique for fabricating structures, which are then pulled up into a pop-up position.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully