Encapsulation method for ball grid array semiconductor package
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United States of America Patent
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Issued Date -
Oct 17, 2002
app pub date -
Jun 17, 2002
filing date -
Jan 11, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
An encapsulation method for a ball grid array (BGA) semiconductor package, includes: adhering one sided adhesive tape to an upper portion of the semiconductor package after performing a wire bonding; carrying out a molding by using a mold having a groove of a certain size inside; and removing the one side adhesive tape after completing the molding, whereby a flash is prevented from occurring during the BGA encapsulation process.
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