Method of making a flexible substrate containing self-assembling microstructures
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United States of America Patent
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Issued Date -
Oct 17, 2002
app pub date -
Feb 2, 2001
filing date -
Feb 2, 2001
priority date (Note) -
Abandoned
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Abstract
A substrate having embossed thereon a plurality of shaped recesses of a predetermined precise geometric profile, each recess having a flat bottom surface having a major dimension of about 500 .mu.m or less, the substrate being capable of undergoing a thermal cycle of about one hour at about 150 .degree. C. while maintaining about .+-.10 .mu.m or less dimensional stability of the embossed shaped indentations, and wherein the substrate comprises an amorphous thermoplastic material. During the thermal cycle the substrate has an elastic modulus greater than about 10.sup.10 dynes/cm.sup.2 and a viscoelastic index of less than about 0.1.
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