Integrated circuit packages assembled utilizing fluidic self-assembly
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United States of America Patent
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-
May 20, 2003
Grant Date -
Oct 24, 2002
app pub date -
Jun 21, 2002
filing date -
Apr 2, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Assembly of integrated circuit packages, such as BGA packaged devices, using fluidic self-assembly. Functional components, such as integrated circuits, having a wired side are suspended in a fluid and flowed over a substrate. The substrate has a top first dielectric layer and recessed receptor regions for receiving the functional components. The functional components are deposited in the receptor regions using fluidic self-assembly such that the wired side is facing outward from the receptor region. A conductive layer is then formed on the first dielectric layer to form conductive interconnects to the functional components. A second dielectric layer is then formed on the conductive layer. The second dielectric layer has openings for receiving conductive elements. Conductive elements, such as solder balls, are deposited into the openings in the second dielectric layer and contact the conductive layer.
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