Probe for the probe card
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Oct 24, 2002
app pub date -
Nov 27, 2001
filing date -
Nov 28, 2000
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
To enable a probe to be applied to a probe card for use in inspecting the IC chip having a fine pitch such as 100 .mu.m, for example, as a pitch size between the electrodes by improving the probe for the probe card having a bare wire structure made of palladium alloy and the probe for the probe card having a bare wire structure made of beryllium copper alloy. There is provided a probe for the probe card characterized in that the same is comprised of a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy. In addition, there is provided a probe for the probe card having a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy and further the wire drawing with the wire drawing dies is applied to it.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully