Formation of an optical component
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Oct 31, 2002
app pub date -
Aug 16, 2001
filing date -
Apr 27, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A method of forming an optical component is disclosed. The method includes obtaining a wafer having a light transmitting medium positioned over a base. The method also includes applying an etching medium to the wafer so as to form one or more surfaces of an optical component in the light transmitting medium. The etching medium is applied in an etching chamber configured to etch a wafer having at least one dimension with a length greater than 6 inches.
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