Method for separating silica waveguides
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United States of America Patent
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N/A
Issued Date -
Nov 7, 2002
app pub date -
May 3, 2002
filing date -
May 4, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method is provided for separating silica waveguides made in multiple units on a wafer at the end of fabrication. Streets are formed between adjacent waveguides by etching the IC material to a substrate. The substrate is then sawed along the streets.
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