Polishing composition having organic polymer particles
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United States of America Patent
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app pub date -
Jan 23, 2002
filing date -
Apr 5, 2001
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Abstract
An aqueous polishing composition for chemical mechanical polishing to remove copper from a buffer material, the composition comprising, an oxidizing agent, a complexing agent, an inhibitor, a dishing reducing agent, and abrasive particles comprising organic polymer particles for clearing relatively soft copper from the buffer material by chemical mechanical polishing while minimizing dishing and avoiding removal of the buffer material.
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