System and method for controlling deposition thickness by synchronously varying a sputtering rate of a target with respect to an angular position of a rotating substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Nov 28, 2002
app pub date -
Apr 25, 2002
filing date -
Mar 16, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A system and method for controlling a circumferential deposition thickness distribution on a substrate includes a motor that rotates the substrate and a positioning sensor that senses an angular position of the substrate. At least one deposition thickness sensor senses the deposition thickness of the substrate at multiple positions on a circumference of a circle centered about an axis of rotation of the substrate. At least one controller drives a vapor source used to emit material for a deposition on a substrate. The at least one controller is coupled to the positioning sensor and the deposition thickness sensor. The controller synchronously varies an emission rate of material from the vapor source with respect to the angular position of the substrate to control the circumferential deposition thickness distribution.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully