Multi-layered spiral couplers on a fluropolymer composite substrate
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United States of America Patent
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Aug 10, 2004
Grant Date -
Nov 28, 2002
app pub date -
Apr 1, 2002
filing date -
Nov 9, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microwave circuit utilizes a spiral-like coupler configuration to achieve the functionality of a traditional coupler with higher density and lower volume. A plurality of substrate layers having metal layers disposed on them are bonded to form the package. A plurality of groundplanes may be used to isolate the spiral-like shape from lines extending out to contact pads or other circuitry.
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