Method of manufacturing laminate and grommet used for the method

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United States of America Patent

APP PUB NO 20020176950A1
SERIAL NO

10187964

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Abstract

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A method of manufacturing a laminate obtained by laminating a plurality of plate members such as wiring plates (1) and prepregs (2), comprising: a step of temporarily fixing the plate members by a grommet (3) having plural resin filling holes (9) formed on the side surface thereof to obtain a temporarily-fixed laminate (5); and a step of heating and pressurizing the temporarily-fixed laminate (5) to fill the resin melted from the prepregs (2) of the temporarily-fixed laminate (5) through the resin filling holes (9) of the grommet (3) into the throughhole (6) of the grommet (3).

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Patent Owner(s)

Patent OwnerAddress
NEC TOPPAN CIRCUIT SOLUTIONS INC2-7 YAESU 2-CHOME CHUO-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Nakajima, Shigeki Toyama, JP 42 575

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