Silicon penetration device with increased fracture toughness and method of fabrication
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United States of America Patent
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Issued Date -
Nov 28, 2002
app pub date -
Mar 26, 2001
filing date -
Mar 26, 2001
priority date (Note) -
Abandoned
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Abstract
A silicon penetration device with increased fracture toughness and method of fabrication thereof are provided. The method comprises strengthening silicon penetration devices by thermally growing a silicon oxide layer on the penetration device and then subsequently stripping the silicon oxide. The method also includes strengthening silicon penetration devices through the sputtering of thin film coatings on the silicon penetration devices.
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