Pad conditioner with uniform particle height
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Dec 5, 2002
app pub date -
Jun 1, 2001
filing date -
Jun 1, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A pad conditioner for conditioning polishing pads that has precisely controlled abrasive particle positioning is formed using a temporary holding layer that establishes a uniform contact plane. The pad conditioners may be formed with multiple levels of contact planes that provide conditioning action at multiple heights occurring simultaneously. The pad conditioners may also be formed with a specified particle orientation, or with multiple sizes of particles.
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