Method and apparatus for cleaning/drying hydrophobic wafers
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United States of America Patent
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N/A
Issued Date -
Dec 19, 2002
app pub date -
Aug 21, 2002
filing date -
Aug 25, 1999
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A method and an apparatus that uses a surfactant to clean a hydrophobic wafer is provided. In a first aspect, the method may clean and dry a wafer without applying pure DI water to the wafer. In a second aspect, the method may clean a wafer by applying pure DI water to the wafer only for a short duration of time such that the DI water application ceases prior to or as soon as a surfactant solution is rinsed from the wafer thereafter the wafer is dried. In a further aspect a hydrophobic wafer is maintained wetted with surfactant as it is transferred between cleaning apparatuses and is rinsed via diluted surfactant or via a brief DI water spray and is thereafter dried.
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