Laser ablation technique
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United States of America Patent
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app pub date -
Mar 18, 2002
filing date -
Mar 16, 2001
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Abandoned
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Abstract
A method of ablating a polymeric substrate by laser means, wherein the laser means emits a laser having a selected wavelength dependant upon the polymeric substrate, and wherein at least 70% of the incident power from the laser means absorbs within 0.001 inches of the polymeric substrate.
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