Heat dissipation system
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United States of America Patent
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N/A
Issued Date -
Dec 19, 2002
app pub date -
Jun 18, 2001
filing date -
Jun 18, 2001
priority date (Note) -
Abandoned
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Abstract
The present invention relates to a heat dissipation system for electronic devices and, more particularly, to a system for dissipating heat in electronics using a pressurized non-volatile gas confined within a thermally conductive enclosure.
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