Thermosetting resin compositions containing maleimide and/or vinyl compounds
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United States of America Patent
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Feb 8, 2005
Issued Date -
N/A
app pub date -
Feb 25, 2002
filing date -
Sep 2, 1994
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In accordance with the present invention, there are provided novel thermosetting resin compositions which do not require solvent to provide a system having suitable viscosity for convenient handling. Invention compositions have the benefit of undergoing rapid cure. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low moisture uptake and are consequently useful in a variety of applictions, e.g., in adhesive applications since they display good adhesion to both the substrate and the device attached thereto.
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Cited Art Landscape
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