Multi-die module
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United States of America Patent
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-
May 8, 2007
Grant Date -
Dec 26, 2002
app pub date -
Jun 21, 2001
filing date -
Jun 21, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A multi-die module is electrically connected to both an unpackaged die and a packaged die as disclosed herein. The multi-die module has a footprint that is the same as conventional multi-die packages, which do not include packaged die, thereby allowing the multi-die module to be interchangeable with conventional multi-die packages. In one embodiment, the unpackaged die is a graphics processor, and the packaged die is a standard memory that has been burned in, functionally tested, and speed rated.
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