Polishing composition for CMP having abrasive particles
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United States of America Patent
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Issued Date -
Jan 9, 2003
app pub date -
May 31, 2002
filing date -
Dec 14, 1999
priority date (Note) -
Abandoned
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Abstract
A polishing composition for CMP to remove a noble metal has a substance forming ligands with the noble metal for dissolution in the polishing composition, abrasive particles, and a surfactant comprising a dispersant of the abrasive particles to minimize formation of agglomerates of the abrasive particles, the abrasive particles being coated by the surfactant to provide surfactant coated abrasive particles that minimize scratching of a surface being abraded by the surfactant coated abrasive particles during CMP.
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