Chemical mechanical polishing compositions and methods relating thereto
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United States of America Patent
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app pub date -
May 17, 2002
filing date -
May 18, 2001
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Abandoned
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Abstract
A polishing composition for removing metal by CMP comprises, a metal oxidizer, an oxide inhibitor, a complexing agent, and an engineered copolymer comprising, molecules of a first moiety having hydrophilic functional groups forming bonds with the metal, and molecules of a second moiety having hydrophobic functional groups.
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