Successive integration of multiple devices process and product
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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N/A
Issued Date -
Jan 23, 2003
app pub date -
Jun 29, 2001
filing date -
Jun 29, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A device integration method involves attaching two components together using a first material having a first melting point, then creating a unit by attaching the two components to a third component, using a second material having a second melting point lower than the first melting point, and then attaching the unit to another component, using a third material, having a third melting point lower than the second melting point. A device having multiple components attached together using a process described herein.
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