Component of printed circuit boards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jan 23, 2003
app pub date -
Jul 13, 2001
filing date -
Jul 13, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A component for use in manufacturing articles such as printed circuit boards having a sheet of copper foil and a metal sheet. One surface of each of the copper sheet and the metal sheet are essentially uncontaminated and engageable with each other at an interface. The copper sheet and the metal sheet are maintained together to define an unjoined and substantially uncontaminated central zone inwardly of the edges of the sheets. A bond is formed between the copper sheet and the metallic sheet along the peripheral edges thereof. The bond has sufficient adhesive strength to maintain the sheets together during manual handling of the component at room temperatures. The bond is temperature-sensitive, wherein the bond deteriorates when exposed to temperatures in excess of about 180.degree. F. (about 82.degree. C.).
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