Micromachined capacitive component with high stability
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United States of America Patent
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-
Sep 7, 2004
Issued Date -
N/A
app pub date -
Jul 16, 2002
filing date -
Dec 22, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A micromachined component such as a transducer having a support structure with a rigid plate secured to the surface of the support structure by means of support arms directly interconnecting the rigid plate and the support structure at discrete locations. A diaphragm of a substantially non-conductive material is secured to the support structure along its periphery at a predetermined distance from the rigid plate. The rigid plate has a surface facing the air gap carrying an electrically conductive surface portion on that surface, and the diaphragm has a surface facing the air gap carrying an electrically conductive surface portion on that surface. For each support arm, at least one of the electrically conductive surface portions is separated from the support arm at a distance along the surface carrying the respective electrically conductive surface portion. This construction ensures a high leakage resistance and a low parasitic capacitance.
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