Chip carrier for a semiconductor chip module
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
N/A
Issued Date -
Feb 20, 2003
app pub date -
Aug 16, 2001
filing date -
Aug 16, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A chip carrier has a cavity portion for receiving a semiconductor chip and a flange portion along at least a portion of a top perimeter of the cavity portion. The module preferably includes a substrate (e.g., a PCB or chip carrier substrate) having a slot for receiving the cavity portion of the chip carrier, with the flange portion of the chip carrier being supported by the substrate. The flange portion is preferably electrically conductive and grounded, so that appropriate conductive pads on the chip can be wire bonded to the flange, while other on-chip pads can be wire bonded to designated pads on the substrate surface.. The cavity portion is also preferably thermally conductive to provide a thermal path for the semiconductor chip. In another embodiment, a relatively thick flanged chip mounting pad is also received within a substrate slot to provide improved heat dissipation.
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