Copper-based metal polishing solution and method for manufacturing semiconductor device
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United States of America Patent
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Issued Date -
Feb 20, 2003
app pub date -
May 3, 2002
filing date -
Dec 14, 1993
priority date (Note) -
Abandoned
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Abstract
Disclosed is a copper-based metal polishing solution which hardly dissolves a Cu film or a Cu alloy film when the film is dipped into the solution, and has a dissolution velocity during polishing several times higher than that during dipping. This copper-based metal polishing solution contains at least one acid selected from aminoacetic acid and aminosulfuric acid, an oxidizer, and water.
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