Method and apparatus for cutting objects
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United States of America Patent
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Issued Date -
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app pub date -
Oct 16, 2002
filing date -
Oct 20, 1998
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
The invention concerns apparatus and method for automatic cutting of objects into portions of reduced dimension. More specifically the invention concerns a cutting device (9) placed horizontally over a transporting conveyor (3). The cutting device is further operatively connected to a computer (6) and moveable in an up- and downward direction with respect to the conveyor. The characteristics of the object to be cut are determined. By utilising at least one of the characteristics to establishing the desired cutting pattern one is able to cut the object into portions of predetermined thickness by band saw cutting blade (7).
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