Second step polishing by CMP
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United States of America Patent
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Issued Date -
Feb 27, 2003
app pub date -
Aug 21, 2001
filing date -
Aug 21, 2001
priority date (Note) -
Abandoned
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Abstract
A polishing fluid for polishing a metal includes, submicron particles, water, and a nonoxidizing reagent for removal of the metal, the nonoxidizing reagent being a hard base anion species of a Lewis base having a chemical bonding affinity for the metal to deter formation of a passivation oxide on the metal, which hard base anion is present in a concentration that maximizes removal of the metal in the absence of the passivation oxide.
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