Substantially non-abrasive thermally conductive polymer composition containing boron nitride
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United States of America Patent
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Issued Date -
Feb 27, 2003
app pub date -
Aug 22, 2002
filing date -
Aug 23, 2001
priority date (Note) -
Abandoned
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Abstract
This invention relates to a thermally conductive molding composition having a thermal conductivity greater than 3 W/m.degree. K. The composition consists essentially of: a) 30% to 60% of a polymer matrix; b) 25% to 60% of boron nitride; and c) 25% to 60% of alumina. The boron nitride and alumina are dispersed throughout the polymer matrix. The composition can be molded or cast into a variety of articles such as packaging materials for semiconductor devices.
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