Leadframe, method of manufacturing the same, semiconductor device using the same, and method of manufacturing the device
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Mar 6, 2003
app pub date -
Aug 26, 2002
filing date -
Aug 31, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A leadframe includes a die-pad portion disposed in a center of an opening defined by a frame portion, and a lead portion disposed around the die-pad portion. The frame portion, the die-pad portion and the lead portion are supported by an adhesive tape, and the lead portion is constituted to have a form in which a plurality of external connection terminals severally consisting of part of leads are arranged in the shape of a grid in a region between the die-pad portion and the frame portion.
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