Sensor substrate and method of fabricating same
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United States of America Patent
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Jan 29, 2008
Grant Date -
Mar 13, 2003
app pub date -
Jan 2, 2002
filing date -
Sep 7, 2001
priority date (Note) -
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Abstract
A substrate with hermetically sealed vias extending from one side of the substrate to another and a method for fabricating same. The vias may be filled with a conductive material such as, for example, a fritless ink. The conductive path formed by the conductive material aids in sealing one side of the substrate from another. One side of the substrate may include a sensing element and another side of the substrate may include sensing electronics.
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