Ultrasonic transducer

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20030062395A1
SERIAL NO

09967222

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A transducer for a wire bonding apparatus is formed of two separate parts sandwiching therebetween a plurality of piezoelectric elements. One of the two parts is the amplifying horn, and by selecting appropriate sizes and shapes for the two parts, vibrational energy can be concentrated at the distal end of the amplifying horn where the bonding tool is located.

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Patent Owner(s)

Patent OwnerAddress
ASM ASSEMBLY AUTOMATION LIMITED4/F WATSON CENTRE 16 KUNG YIP STREET KWAI CHUNG KOWLOON

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chan, Helen Lai Wa Kowloon, HK 6 76
Li, Hing Leung Kowloon, HK 9 37
Liu, Peter Chou Kee Kowloon, HK 2 16
NG, Kelvin Ming Wai Kowloon, HK 2 16

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