Co-bonded joint with Z-pins
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United States of America Patent
Stats
-
Nov 23, 2004
Grant Date -
Apr 10, 2003
app pub date -
Oct 9, 2001
filing date -
Oct 9, 2001
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A method is provided for using a woven preform having a base and at least one leg extending from the base. The preform is used to assemble first and second composite laminate components formed from tape or fabric and a resin matrix. Z-pins are inserted into the first component prior to its being cured, forming a stubble extending above a surface of the first component. The uncured preform is placed on the surface of the first component, the stubble extending into the preform. The cured second component is attached to the preform. Over-wrap plies are optionally placed on the outer surfaces of preform. Adhesive is optionally placed between the preform and the first and second components. A vacuum bag and tooling are used while curing the preform to adhere the legs of the preform to the second component and the base of the preform to the first component.
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Cited Art Landscape
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