Importance

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Abstract

The present invention features an ultra high density, high frequency, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the package before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology. The daughter cards may be equipped with structures such as ground planes, etc. to minimize electrical noise, control and match impedances and signal path lengths, and maintain signal synchronization (i.e., controlling skew). The inventive memory daughter cards may also contain thermal management structures contacting the chips, which conduct heat away from the chips. Such structures may be constructed by interleaving heat-spreading fins between the individual chip components and/or daughter boards.

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First Claim