Semiconductor system-in-package

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7176556
APP PUB NO 20030080400A1
SERIAL NO

10092525

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer formed on or above said support substrate, leading some of said through holes filles with conductor upwards through said capacitor, having branches, and having wires of a second pitch different from said first pitch; and plural semiconductor elements disposed on or above said wiring layer, having terminals adapted to the second pitch, and connected with said wiring layer via said terminals. A semiconductor apparatus, in which semiconductor elements having a narrow terminal pitch, a support having through wires at a wider pitch, and a capacitor are suitably electrically connected to realize the decoupling function with reduced inductance and large capacitance.

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Patent Owner(s)

  • FUJITSU LIMITED

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Imanaka, Yoshihiko Kawasaki, JP 60 507
Okamoto, Keishiro Kawasaki, JP 21 189
Omote, Koji Kawasaki, JP 19 362
Shioga, Takeshi Kawasaki, JP 73 930
Taniguchi, Osamu Kawasaki, JP 72 1593
Yamagishi, Yasuo Kawasaki, JP 53 1210

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