Silica particles for polishing and a polishing agent
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United States of America Patent
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Nov 25, 2003
Grant Date -
May 15, 2003
app pub date -
Nov 12, 2002
filing date -
Nov 15, 2001
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Abstract
Silica particles for polishing have a three-dimensional polycondensation structure with an average particle diameter in a range from 5 to 300 nm. The silica particles have residual alkoxy groups therein and a carbon content in a range from 0.5 to 5 weight % retained in the residual alkoxy groups.
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