Importance

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Abstract

A multi-package module package includes a plurality of individually packaged chips. Yield is increased over conventional multi-chip packages because the individual chips can be inexpensively and fully tested before being placed into the multi-package module package. Also, the manufacturing process is simpler because the individual chips can be more easily handled while being tested and attached to the multi-package module package. Further, a standard component surface mount process is used for package assembly. Thus, no new capital investment or process development is needed.

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First Claim