Edge gripping device for handling a set of semiconductor wafers in an immersion processing system
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United States of America Patent
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Jan 25, 2005
Grant Date -
May 29, 2003
app pub date -
Nov 11, 2002
filing date -
Nov 13, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
A microelectronic substrate handling device comprising first and second support structures spaced from each other, the first support structure having a series of upper teeth defining a series of upper notches extending along a length of the first support structure and a series of lower teeth defining a series of lower notches extending along a length of the first support structure, each of the upper and lower notches opening toward the second support structure, wherein the upper and lower notches are offset from each other by a predetermined offset distance so that an edge of a microelectronic device will fit differently within the upper and lower notches of the first support structure when supported between the first and second support structures.
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