System and method for mounting electronic components onto flexible substrates
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United States of America Patent
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Nov 4, 2003
Grant Date -
Jun 5, 2003
app pub date -
Dec 3, 2001
filing date -
Dec 3, 2001
priority date (Note) -
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Abstract
A system and method for reflowing solder to interconnect a plurality of electronic components to a substrate is disclosed. The system includes an oven for preheating the substrate and the plurality of electronic components disposed thereon, a supplemental heat source disposed in the oven for providing additional heat energy to reflow the solder, and a pallet for supporting the substrate, wherein the supplemental heat source creates a stream of hot gas that flows transversely across the substrate.
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