USE OF FLUOROPOLYMER COATING FOR PLANARIZING AND PASSIVATING INTEGRATED CIRCUIT DEVICES
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United States of America Patent
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N/A
Issued Date -
Jun 5, 2003
app pub date -
Nov 30, 2001
filing date -
Nov 30, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
A touch-sensitive semiconductor chip having a physical interface to the environment, where the surface of the physical interface is coated with a fluorocarbon polymer. The polymer is highly scratch resistant and has a characteristic low dielectric constant for providing a low attenuation to electric fields. The polymer can be used instead of conventional passivation layers, thereby allowing a thin, low dielectric constant layer between the object touching the physical interface, and the capacitive sensing circuits underlying the polymer.
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