Low-shrinkage epoxy resin formulation
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United States of America Patent
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-
Dec 16, 2003
Grant Date -
Jun 5, 2003
app pub date -
Nov 28, 2001
filing date -
Nov 3, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Low-shrinkage positioning formulations include, in addition to the resin-forming composition, a filler comprised of fibrous and spherical elements, usually of glass, present in a defined ratio and amount. The resin formulation may desirably comprise epoxy resin and a copolymerizable monomer having amide, acrylamide, or hydroxyl functionality, and may advantageously be devoid of any cationic catalyst ingredient.
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Cited Art Landscape
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