Programmable chip-to-substrate interconnect structure and device and method of forming same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
N/A
Issued Date -
Jun 12, 2003
app pub date -
Sep 26, 2002
filing date -
Aug 31, 1999
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A structure and system for forming an electrical interconnection between a microelectronic device and a substrate and a method of forming the interconnection are disclosed. The interconnection includes a first electrode formed on the microelectronic device, a second electrode formed on the substrate, and an ion conductor placed between the first and second electrodes. An electrical connection between the microelectronic device and the substrate is formed by applying a bias across the first and second electrodes to form a conductive region within the ion conductor.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully