Ablation instrument and method for cutting, fragmenting and/or removing material
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United States of America Patent
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N/A
Issued Date -
Jun 12, 2003
app pub date -
Feb 15, 2002
filing date -
Dec 6, 2001
priority date (Note) -
Abandoned
status (Latency Note)
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Abstract
Ablation instrument is provided for cutting, fragmenting and/or removing material of an object, containing a carrier substrate, having at least one resistance-heated layer which is disposed on the substrate and made of doped diamond or diamond-like carbon (DLC) and also at least one electrical lead and at least one electrical discharge which are both electrically connected at different places by the resistance-heated layer.
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