Low profile subcutaneous enclosure
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United States of America Patent
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-
N/A
Issued Date -
Jun 12, 2003
app pub date -
Dec 12, 2001
filing date -
Dec 12, 2001
priority date (Note) -
Abandoned
status (Latency Note)
Importance
Abstract
A design and method for fabricating a low profile, biocompatible, hermetically sealed, subcutaneous enclosure for human implants is disclosed. The implant includes bonded top and a bottom plates, and an insert bonded to an aperture in the bottom plate. Passageways that extend through the insert are filled with a conductive material to provide hermetic but conductive leads to the interior of the implant. Successive layers of metals are used to bond the insert to the bottom plate and to establish a bond between a first layer of polymer covering the insert and bottom plate. An additional polymer layer containing contact pads and conductor lines is bonded to the first layer. The implant includes a low profile safety on-off switch and a hermetically sealed low profile rechargeable battery.
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