Method of forming tapered electrodes for electronic devices
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United States of America Patent
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Issued Date -
Jun 19, 2003
app pub date -
Dec 14, 2001
filing date -
Dec 14, 2001
priority date (Note) -
Abandoned
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Abstract
In the method, a substrate is coated with different films to be patterned. These films have different etch rates. The films and substrate are then coated with a primary etch mask, and subsequently patterned to produce an electrode that has a gradual taper at the electrode edge. The formed electrode eliminates any abrupt substrate to electrode step, so that any subsequent thin-film deposition of piezoelectric material is continuous over the entire electrode surface and the electrode/substrate interface.
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