Flex tab for use in stacking packaged integrated circuit chips

Number of patents in Portfolio can not be more than 2000

United States of America Patent

APP PUB NO 20030113998A1
SERIAL NO

10024389

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A connector for use in a chip stack including at least first and second stacked packaged chips which each comprise a package body having a plurality of leads extending therefrom. The connector comprises a substrate which is preferably fabricated from an insulating material. Attached to the substrate are a plurality of flex tabs which extend in spaced relation to each other, and are each preferably fabricated from a conductive material such as aluminum. The flex tabs are each shaped to define an arcuately contoured first portion which is electrically connectable to a respective one of the leads of the first packaged chip, and an integral, generally flat second portion which extends along a portion of the substrate and is electrically connectable to a corresponding one of the leads of the second packaged chip.

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Patent Owner(s)

Patent OwnerAddress
OPAC TECHNOLOGIES CORP7321 LINCOLN WAY GARDEN GROVE CA 92841

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ross, Andrew C Ramona, CA 9 380

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