Electronic component including a housing and a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 16, 2005
Grant Date -
Jun 26, 2003
app pub date -
Dec 16, 2002
filing date -
Jun 14, 2000
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
The invention relates to an electronic component including a housing and a first substrate having at least one integrated circuit, a multiplicity of contact surfaces arranged in an arbitrary distribution on the surface of the first substrate. A second substrate forms a housing and is mechanically joined to the surface of the first substrate in a surface-to-surface contact, via an insulating joining layer. The second substrate has contact connection surfaces that are surface-to-surface connected to the contact surfaces of the first substrate in an electrically conductive manner. The second substrate has symmetrically arranged external contact surfaces that are conductively connected to the contact connection surfaces via through-contacts in the second substrate.
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