Thin film chip resistor and method for fabricating the same
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United States of America Patent
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Issued Date -
Jun 26, 2003
app pub date -
Aug 5, 2002
filing date -
Dec 20, 2001
priority date (Note) -
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status (Latency Note)
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Abstract
Disclosed is a thin film chip resistor having a structure suitable for effectively utilizing a slit substrate and simplifying a thin film forming step, in which thick film electrodes are formed on upper and lower surfaces of an insulator substrate, the thin film resistive layer is formed between thick film electrodes, and thin film electrodes connected to the thin film resistive layer are formed on both side portions of the upper surface of the insulator substrate. Furthermore, provided is a method for fabricating the thin film chip resistor, which can omit the step of forming thin film on a lower surface of the insulator substrate and minimize a defective proportion, which may occur during parting the insulator substrate along slits, by securing a space sufficient for contacting to probes with electrodes in a laser trimming step.
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