Copper polishing cleaning solution
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United States of America Patent
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app pub date -
Jan 16, 2002
filing date -
Dec 7, 2001
priority date (Note) -
Abandoned
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Abstract
A cleaning solution for removing copper complex residues from the surface of polishing pads and wafer substrates includes an amine pH-adjusting agent, which can be a unidentate or bidentate amine compound or a quartnary ammonium hydroxide compound or an amine including an alcohol group. The cleaning solution also includes an amino acid complexing agent and an inhibitor. In a preferred embodiment, the cleaning solution has a basic pH.
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